UltraMapS-200FP - Solar Cell Thickness, Bow and Flatness Measurement
Specification
- Non-contact wafer thickness measurement system.
- Solar wafers application with fixed probes
- Thickness, TTV, TIR ,Bow, Warp, Flatness
- Measures bare and patterned cells
- Manual loading of the wafer, automated mapping
- Wafer size: up to 210 mm square wafers
- Resolution 0.1µm
- Accuracy: 0.5 µm
- 2D & 3D mapping
- Silver line topography measurement (Hiscan)
- All materials, all surfaces
- Store up to 99 recipes for each wafer size.
- Results available in table format or 2D and 3D color mapping.
Options
- Loading/unloading module for cassette to cassette operation
Benefits
- Fast and accurate measure
- All wafer sizes, shapes, thickness and warpage ranges.
- Easy to use
- Modular stations to grow with user’s needs
- Great adaptability and flexibility
- Lowest operating cost
- Limited maintenance and lowest cost of ownership
- Dependability with uptime over 98%
- Limited calibration requirement
- Multiple functions
Applications
- QA control off line for incoming cells or post firing
- Control of finger roughness and profile