SigmaTech UltraMap-300IR
Automated Thickness measurement system
- IR interferometry probe technology
- Single or dual probes
- manual loading
- 0.5um accuracy. O.1um resolution
- Wafer 4” to 12” (50 to 300mm) round or square
- Thickness range: 20um to 1mm
- Flexible recipe generation
- 2D & 3D mapping capability
- SECS/GEM communication
Options
- Extended warp/bow range up to 5000um
- Wafer prealigner
- Samples with special shape (square, rectangle, round)
Features
- Thickness and shape measurement of Wafers with backgrinding tape
- Wafer on sawframe
- Dies on tape
- Wafer with bumps
- SOI
- Multiple layers
- Bonded wafers
- Thickness of Si
- Plastic
- Glass
- Adhesive layers
