Sigmatech UltraMap-300IR
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Automated Thickness measurement system
- IR interferometry probe technology
- Single or dual probes
- manual loading
- 0.5um accuracy. O.1um resolution
- Wafer 4” to 12” (50 to 300mm) round or square
- Thickness range: 20um to 1mm
- Flexible recipe generation
- 2D & 3D mapping capability
- SECS/GEM communication
Options
- Extended warp/bow range up to 5000um
- Wafer prealigner
- Samples with special shape (square, rectangle, round)
Applications
Thickness and shape measurement of Wafers with backgrinding tape, wafer on sawframe, dies on tape, wafer with bumps, SOI, multiple layers, Bonded wafers. Thickness of Si, plastic, glass, adhesive layers