SigmaTech UltraMap-300
Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
- Wafer 4” to 12” (100 to 300mm)
- Thickness range: 50um to 3mm
- Extended warpage range up to 5mm
- Throughput up to 120 wafers / hour
- 2D & 3D mapping capability
- Full SECS/GEM compatibility
- Automated calibration
Options
- Edge gripper/non-contact handling
- Extended warp/bow range up to 5000um
- Wafer prealigner
- Roughness measurement
Applications
High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping.