Metrology
Working with various companies S3-Alliance can offer metrology solutions for the following application areas:
Wafer Dimensional Metrology
- Thickness, TTV, Bow, Warp measurement
- Wafer Characterization
- Layer thickness measurement
- Ultrathin wafer substrates
Wafer Surface Metrology
- Non-contact Surface profilometry
- Roughness measurement
- MEMS
- Bumps dimensions
- Film Thickness
- Step Height, cavities
Thin Films
- Semiconductors: Poly-Si, GaAs, GaN, InP, ZnS + Si, Ge, SiGe...
- Dielectrics: SiO2, TiO2, TaO5, ITO, ZrO2, Si3N4, Photoresist, ARC,...
- Display(including LCD, PDP, OLED, CRT): a-Si, n+-a-Si, Gate-SiNx MgO, Alq, ITO, PR, CuPc, NPB, PVK, PAF, PEDT-PSS, Oxide, Polyimide...
- Optical coating: Hard coating, Anti-reflection coating, Color Filters...
- Solar cell: Doping a-Si(i-type, n-type, p-type), TCO(ZnO, SnO, ITO..)
- Polymers: PVA, PET, PP, Dye, Npp, MNA, TAC, PR...
- Recordable materials: Photosensitive drum, Video head, Photo masks, Optical disk...
- Other: CRT Photoresist film, Shadow masks, Thin metal films, Laser mirrors...