nTellect 100 - 200mm Wafer Grinder
Advanced Wafer Grinding for Semiconductor, Data Storage, SOI, LED, and R&D
The first to introduce a fully-automatic infeed rotary surface grinder for semiconductor wafers, Strasbaugh continues its leadership with the unique nTellect® wafer grinder.
Specifications
- Tapeless BackgrindingTM
- 100mm – 200mm
- In-feed technology
- In-situ thickness control
- Force adaptive grinding
- Linear traversing grind spindles
- Automated process control
- Thin wafer handling
Benefits
- Reduced sub-surface damage
- Improved surface finish
- Repeatable thickness control
- Low cost
- Well-suited for a broad range of applications, including hard materials
Applications
- Integrated Circuit Backgrinding
- SOI (Silicon on Insulator)
- Prime Wafers
- GaAs (Gallium Arsenide)
- LiNbO3 (Lithium Niobate)
- AlTic (Aluminum Titanium Carbide for Read/Write Heads)
- Glass
- Sapphire
- Quartz