nGenuity 50 - 150mm Wafer Grinder
Advanced Wafer Grinding Capability for 150mm Wafers and Smaller
Strasbaugh's nGenuity® (7AA) grinder is an automated infeed grinder capable of performing a wide variety of grinding applications on wafers ranging from 75 to 150mm in diameter. Strasbaugh pioneered infeed vertical grinding technology, a method now universally applied by all wafer grinder manufacturers. This technique removes stock from the wafer rapidly and uniformly while minimizing stress and warpage. nGenuity can meet the most stringent stock removal, flatness, and surface finish requirements.
nGenuity Specifications
- 50mm – 150mm
- In-feed technology
- In-situ thickness control
- Automated process control
nGenuity Benefits
- Reduced sub-surface damage
- Improved surface finish
- Repeatable thickness control
- Low cost
- Well-suited for a broad range of applications, including hard materials
nGenuity Applications
- Integrated Circuit Backgrinding
- SOI (Silicon on Insulator)
- Prime Wafers
- GaAs (Gallium Arsenide)
- LiNbO3 (Lithium Niobate)
- AlTic (Aluminum Titanium Carbide for Read/Write Heads)
- Glass
- Sapphire
- Quartz