Linde EcoSnow WaferClean 2100™ - Co2 Cleaning System
The Eco-Snow® advanced WaferClean 2100™ System removes particulate contamination, post-etch veils and fences, as well as thin-film organic residues from Silicon, Compound, MEMS and MR Head wafers using a unique carbon dioxide (CO2) snow cleaning process. Eco-snow cleaning is a fast, environmentally friendly, “all dry” non-contact process that offers numerous advantages over conventional wet cleaning systems.
Specifications
- Stand-alone automated system
- Environmentally controlled Class 1 cleaning chamber
- Cassette-to-cassette handling
- User friendly flat panel touch screen color display
- Wafer temperature control
- Internal dew point monitor
- Compact footprint
- Advanced ESD control
- GEM/SECS-II software
- Simple facilitization
- CE Marked, Semi S2, S8 compliant
Benefits
- Superior cleaning performance
- Reduced cycle times
- No chemical waste
- Non-damaging clean of fragile structures
- High PRE down to nano particle size
- High throughput due to