Semiconductor/MEMs
Process Equipment
Facilities Equipment
Parts & Consumables
- CMP Conditioning Discs
- CMP Polishing Pads
- CMP Retaining Rings
- CMP Slurry
- Chemical Heaters
- Deionized Water Heaters
- Dicing
- Electrostatic Chucks
- FOUP / FOSB
- Four Point Probe Heads
- Heater Pedestals
- High Purity Pumps
- MagLev Pumps
- Metal Cassettes
- Process Cassette/Carriers
- Reticle/Mask Handling
- Shipping Boxes
- Stepper Chucks
Service
Cleaning Products
UV Ozone Cleaning
Proteus UV/Ozone cleaning system is a tool designed for surface cleaning and curing of any kind of surface, and in particular for surfaces to be decontaminated by organic residues before wire bonding. Wafers can also be cured by UV-Ozone to remove reist residues or to enhance oxide thickness in epitaxy. UV/Ozone system is based on high frequency UV lamps and features a controlled irradiation. Ozone oxidizes residues on the parts surface, and UV/C irradiation will produce a surface curing and decontamination.
To prepare surfaces for wire bonding, such as in COB processes, where plastic parts have to be assembled together with special glues or resins, like in packaging technology, to remove resist residues from wafers or when a metal part have to be cleaned and decontaminated from organic residues without aggressive chemicals or mechanical actions, Proteus UV/Ozone cleaner can be the right solution. UV is a cost effective alternative to plasma etching, since it is not required any special vacuum chamber, nor gases or special facilities.
UV-Ozone cleaning can also be arranged to make cleaning lines with continuous loading, and can be coupled to a DI water rinse system to completely remove particles from surfaces. The benchtop version is equipped with high pressure, high frequency UV tubes, with electronic ballasts and a motorized platform to drive parts into the cleaning chamber. Safety sensors will avoid ozone environment contamination and UV exposition to the operator. Control interface is extremely simple and user friendly, not requiring any special training for operators.
Specifications
- Operation Semi automatic with motorized drawer platform (manual for Lab. unit)
- Control Microprocessor controlled with operator interface (only Auto version)
- Lamps 180-250 nm UV Ozone generating lamps with electronic ballasts
- Lifetime minimum 7000 hours to reach a 50% lamp efficiency
- Typical applications Wire bonding, die attach, Oxide increasing in silicon epitaxy processes
- Platform Dimensions 350 mm W x 350 mm (60 mm x 350 Lab. unit)
- Facilities AC 220 - 240 V - 2 A 50 /60 Hz
- Exhaust ø 100mm - 250 m3 h UVClean AutoExhaust ø 32 mm UVClean Lab. Unit