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Tango Systems, Inc.'s Axcela™ system offers an easily scalable design, allowing the customer to select the most flexible, cost-effective design for a given application. Designed for serviceability with the lowest cost of ownership (CoO) - One chamber with the capability of running up to 3 different materials (4 target optional) significantly reducing the required spare parts and complexity of the system.

The Axcela™ System Advantages:

• High Throughput
• Low CoO
• Small Footprint
• Wafer Size Flexibility
• Process Flexibility
• Application Flexibility
• High Reliability
• No remote subsystems
• High Vacuum Chambers

Benefits

Power control with Small-Batch processing

Unlike single wafer cluster tools, the Axcela™200 runs 6x 200mm wafers per run (8x 150mm wafers, 4x 300mm wafers). Deposition rates can be closely controlled by process engineers as each Kilo-watt of DC or RF power is distributed over a batch of wafers vice one. 

Multi-level vacuum barrier

Contamination potential is minimized through staged vacuum levels from the load-lock to the transfer chamber, pre-clean and finally the PVD chamber. 

Full face erosion of targets; low particulate concerns

The patent protected, D-Source magnetron, provides high target utilization with full face erosion. Minimizing particulates with advanced magnetron processing provides the most continuous films available from a PVD system.

The Small-Batch-Cluster architecture offered on the Axcela™ systems makes this PVD tool an excellent choice for most metallization applications, including BSM, MEMS, TSV, UBM and other applications. The system provides: