PVD Systems
Axcela™ System Overview
Tango Systems, Inc.'s Axcela™ system offers an easily scalable design, allowing the customer to select the most flexible, cost-effective design for a given application. Designed for serviceability with the lowest cost of ownership (CoO) - One chamber with the capability of running up to 3 different materials (4 target optional) significantly reducing the required spare parts and complexity of the system.
The Small-Batch-Cluster architecture offered on the Axcela™ systems makes this PVD tool an excellent choice for most metallization applications, including BSM, MEMS, TSV, UBM and other applications. The system provides:
The Axcela™ Benefits
Power control with Small-Batch processing
Unlike single wafer cluster tools, the Axcela™200 runs 6x 200mm wafers per run (8x 150mm wafers, 4x 300mm wafers). Deposition rates can be closely controlled by process engineers as each Kilo-watt of DC or RF power is distributed over a batch of wafers vice one.
Multi-level vacuum barrier
Contamination potential is minimized through staged vacuum levels from the load-lock to the transfer chamber, pre-clean and finally the PVD chamber.
Full face erosion of targets; low particulate concerns
The patent protected, D-Source magnetron, provides high target utilization with full face erosion. Minimizing particulates with advanced magnetron processing provides the most continuous films available from a PVD system.
The Axcela™ System Advantages:
- High Throughput
- Low CoO
- Small Footprint
- Wafer Size Flexibility
- Process Flexibility
- Application Flexibility
- High Reliability
- No remote subsystems
- High Vacuum Chambers