Linde EcoSnow WaferClean 3600 - Co2 Cleaning System
The Eco-Snow® advanced WaferClean 3600™ System removes sub-micron particle contamination, post-etch residues, veils and fences, as well as thin-film organic contaminates from Silicon, MEMS and MR Head wafers using a unique carbon dioxide (CO2) snow cleaning process. Eco-Snow cleaning is a fast, environmentally friendly, “all dry” non-contact process that offers numerous advantages over conventional wet cleaning systems.
Specifications
- Industry standard 200 or 300 mm interface
- Processing at atmospheric pressure
- High throughput
- Environmentally controlled Class 1 cleaning chamber
- Advanced ESD control
- Unlimited, recipe driven, user interface
- Substrate temperature control
- Internal dew point monitor
Benefits
- Compact footprint
- Simple facilitization
- GEM/SECS-II software
- Low cost of ownership
- Multiple process capability
- No DI water or chemical waste
- Non-damaging clean of fragile structures
- High PRE down to nano particle size
- Single step dry process
- High up-time, low MTTR