Linde EcoSnow PrecisionClean 1000™ Co2 CCD, MEMS, Packaging Cleaning System
The Eco-Snow® advanced PrecisionClean 1000™ System removes sub-micron particle contamination from a variety of electronic devices during packaging, using a unique carbon dioxide (CO2) snow cleaning process. Eco-Snow cleaning is a fast, environmentally friendly, “all dry” non-contact process that offers numerous advantages over conventional wet cleaning systems.
Specifications
- In line processing
- Processing at atmospheric pressure
- High throughput
- Inter-tool communication protocol
- Environmentally controlled Class 1 cleaning chamber
- Electro-static discharge control
- Internal dew point monitor
Benefits
- Compact footprint
- Simple facilitization
- Low cost of ownership
- No DI water or chemical waste
- Non-damaging clean of fragile structures
- High PRE down to nano particle size
- Single step dry process
- High MTBF, low MTTR
Applications
- CCD Packages
- MEMS Packaging
- Ceramic Leads